-
1 laser bonding
лазерне зварюванняEnglish-Ukrainian dictionary of microelectronics > laser bonding
-
2 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
3 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
-
4 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
5 welding
зварка, зварювання (див. т-ж bonding, weld) - butt welding
- cold welding
- diffused welding
- electron-beam welding
- laser welding
- one-at-а-time welding
- resistance welding
- seam welding
- spot welding
- stitch welding
- ultrasonic ring welding
См. также в других словарях:
Laser bonding — is a marking technique that uses lasers and other forms of radiant energy to bond an additive marking substance to a wide range of substrates. Invented in 1997, this patent protected technology[1] delivers permanent marks on metals, glass and… … Wikipedia
Laser engraving — is the practice of using lasers to engrave or mark an object. The technique can be very technical and complex, and often a computer system is used to drive the movements of the laser head. Despite this complexity, very precise and clean… … Wikipedia
Laser ablation — is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the… … Wikipedia
Laser — For other uses, see Laser (disambiguation). United States Air Force laser experiment … Wikipedia
Laser applications — There are many scientific, military, medical and commercial laser applications which have been developed since the invention of the laser in the 1958. The coherency, high monochromaticity, and ability to reach extremely high powers are all… … Wikipedia
Laser printer — HP LaserJet 4200 series printer, installed atop high capacity paper feeder … Wikipedia
Hybrid silicon laser — A hybrid silicon laser is a semiconductor laser fabricated from both silicon and group III V semiconductor materials. The hybrid silicon laser was developed to address the lack of a silicon laser to enable fabrication of low cost, mass producible … Wikipedia
Optical contact bonding — is a glueless process whereby two closely conformal surfaces are joined together, being held purely by intermolecular forces. Contents 1 History 2 Explanation 3 Production of an optical contact bond 4 … Wikipedia
Diode Laser — Une diode laser est un composant opto électronique à base de matériaux semi conducteurs. Elle émet de la lumière monochromatique cohérente (une puissance optique) destinée, entre autres, à transporter un signal contenant des informations (dans le … Wikipédia en Français
Diode laser — Une diode laser est un composant opto électronique à base de matériaux semi conducteurs. Elle émet de la lumière monochromatique cohérente (une puissance optique) destinée, entre autres, à transporter un signal contenant des informations (dans le … Wikipédia en Français
Rapid prototyping — For rapid software prototyping, see rapid application development. A rapid prototyping machine using selective laser sintering. Rapid prototyping is the automatic construction of physical objects using additive manufacturing technology. The first … Wikipedia